Home \ Processes \ Multilayer Process
Our double and multilayer facility was established in 2002, since then there had been enormous upgrades and expansions to meet market demands. Further refinements from R&D allowed us to make PCBs up to 12 layers.

Below are some highlights of our advanced processes:
  • Mulitlayer lamination
  • 5 Fully automatic plating lines
  • Horizontal spray solder mask system
  • Wet & Dry film
  • Fully automatic ENIG line
  • Leadfree Hot air solder levelling
  • OSP coating with optional chemical withstanding 3 times solder reflow
  • Ionic cleaning
  • CNC V-cut
  • Immersion Sn
  • Immersion Ag

Contact us for more information