Double-sided Process


Our double and multilayer facility was established in 2002, since then there had been enormous upgrades and expansions to meet market demands. The total monthly capacity is 72,000m2. To meet the technological and ecological demands of today's industries, we offer a wide range of product that will fulfill those needs

Below are some highlights of our advanced processes:

● 5 Fully automatic plating lines

● Horizontal spray solder mask system

● Wet & Dry film

● Fully automatic ENIG line

● Leadfree Hot air solder levelling

● OSP coating with optional chemical withstanding 3 times solder reflow

● Ionic cleaning

● CNC V-cut

● CNC drilling

● CNC routing

● Outline punching