Multilayer Process


Our double and multilayer facility was established in 2002, since then there had been enormous upgrades and expansions to meet market demands. Further refinements from R&D allowed us to make PCBs up to 12 layers.

Below are some highlights of our advanced processes:

● Mulitlayer lamination

● 5 Fully automatic plating lines

● Horizontal spray solder mask system

● Wet & Dry film

● Fully automatic ENIG line

● Leadfree Hot air solder levelling

● OSP coating with optional chemical withstanding 3 times solder reflow

● Ionic cleaning

● CNC V-cut

● Immersion Sn

● Immersion Ag